This article introduces Mitsubishi Electric’s 6500V X-Series High Voltage IGBT module for power modules operating at 150ºC junction temperature. The 6500 V X-Series high current IGBT power module breaches the technological barrier for operating at 150 °C junction temperature by employing the 7th Generation IGBT and Diode chip-sets. This could potentially unlock the possibility of … Read more
This article highlights semiconductor solutions using Infineon Technologies AG IGBT modules belonging to the PrimePACK™ family equipped with IGBT/FWD chips. The requirements regarding modern light traction vehicles, such as trolleybuses and trams, gradually increase. Special focus is set to operation without trolley power supply temporarily while remaining free of emissions. Efficiency, power density, volume and … Read more
This article covers the basics of MOS transistors with a view towards better understanding the leakage current that can occur in such transistors. MOS transistors are getting scaled down to maximize their package density inside integrated circuits. This has led to the reduction of oxide thickness which, in turn, has reduced the threshold voltage of … Read more
Low power consumption has become an important design goal in many electronic systems. This article introduces essential concepts and techniques. Low power consumption has become an important design goal in many electronic systems. This article introduces essential concepts and techniques. In this article, we’ll explore some foundational information related to minimizing power consumption in microcontroller-based … Read more
This article discusses the major causes of high temperatures on PCBs that cause failure and damage to the board itself. Excess heat on printed circuit boards (PCBs) can result from poor design, incorrect parts and material selection, wrong component placement, and inefficient heat management. The resulting high temperatures negatively affect functionality, components, and the board itself. The … Read more
