6500 V X-Series High Voltage IGBT Modules

This article introduces Mitsubishi Electric’s 6500V X-Series High Voltage IGBT module for power modules operating at 150ºC junction temperature. The 6500 V X-Series high current IGBT power module breaches the technological barrier for operating at 150 °C junction temperature by employing the 7th Generation IGBT and Diode chip-sets. This could potentially unlock the possibility of … Read more

Automated Acoustic Inspection for IGBT Modules

This article discusses the non-destructive inspecting of IGBT modules for internal structural defects such as voids, non-bonds, delamination and cracks. High-power IGBT modules have long needed a non-destructive method to inspect for internal structural defects such as voids, non-bonds, delaminations and cracks. The best time for such inspection is after assembly but before encapsulation, which … Read more

7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance

This article features Mitsubishi Electric Europe B.V. 7th Generation IGBT Modules with the analysis of IGBT chip and diode chip performances. For power electronic systems like industrial drives and converters for renewable energy applications, the major system requirements are high reliability, high efficiency, high power density, and competitive costs. In order to meet these requirements, … Read more

Novel Technique to Reduce Substrate Tilt amp Improve Bondline Control between AlN Substrate and AlSiC Baseplate in IGBT Modules

This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and AlSiC Baseplate in IGBT Modules./></body></html> Large area solder joints in multi-chip power semiconductor packages experience fatigue caused by the periodic straining of the interconnection layers during thermal excursions as the device is operational. These stresses lead to … Read more

Temperature Limits for Power Modules Part-1: Maximum Junction Temperature

This article features Infineon temperature limits for power module by understanding the effect of changing operating conditions and application parameters. The estimate of the junction temperature of a power semiconductor chip is typically made using the power loss in the chip and the thermal resistance value listed in the device data sheet, considering this thermal … Read more

An Intelligent IGBT Module for Single-Ended Induction Heating Applications: All-in-One Solution for Induction Cooking System

This article introduces Alpha & Omega Semiconductors’ new IGBT Module that is specifically designed for induction heating (IH) applications, the IPM6. Induction heating (IH) application has developed with requirements of higher efficiency, compactness, cost-effectiveness, and reliability. Even with a simple structure, the single-ended IH system operates in high power condition as a domestic application with … Read more

Eliminating Voltage Overshoots for High-performance Modules in the Mega-watt Range

High-performance IGBT modules switch currents in the kA range, whereby unwanted and in some cases harmful voltage overshoots can occur due to DC link leakage inductances. With its latest development, the SkiiP®4 IGBT module manufacturer Semikron has optimized both design and performance. The new model has a DBC concept (Direct Bond Copper) with no base … Read more

3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

This article introduces software MFis Wire and its advantages in significantly shortening time for creating complex 3D geometry models of bond wire layouts. Raffael Schnell and Samuel Hartmann are co-authors of this article originally published in Bodo’s Power Systems magazine. Speeding up the electromagnetic module design for maximum Chip performance utilization and highest robustness with the latest … Read more

Si IGBT Modules for High-Frequency Operation

Several power conversion applications require operation at high switching frequencies (above 20kHz). This includes applications where optimizing the size of passive components such as filter inductances plays an important role. For certain applications, reducing audible noise generated due to the carrier frequency is an important design consideration. To fulfill the requirements of high switching frequency … Read more