Change of guards at Intel Foundry Services (IFS)

Randhir Thakur, senior VP and president of Intel Foundry Services (IFS), is leaving after a rollercoaster ride to turn Intel into a world-class systems foundry. While at the helm of Intel’s IDM 2.0 drive, he recently expressed hope that IFS will eclipse Samsung’s foundry business by 2030. Thakur, a semiconductor industry veteran with stints at … Read more

All you need to know about GAA chip manufacturing process

The gate-all-around (GAA) semiconductor manufacturing process, also known as gate-all-around field-effect transistor (GAA-FET) technology, defies the performance limitations of FinFET by reducing the supply voltage level and enhancing performance with a boost in drive current capability. In short, the GAA technology allows transistors to carry more current while staying relatively small. The semiconductor industry transitioned … Read more

Arm Virtual Hardware available on GitHub, AutoML platforms

Arm is joining hands with GitHub and cloud-based artificial intelligence (AI) and Internet of Things (IoT) toolchain suppliers in a bid to expand the availability of its tools like cross-compiler and Arm Virtual Hardware. Arm, for instance, is integrating its development tools into GitHub Actions, a CI/CD platform that allows developers to automate their build, … Read more

TSMC approaching 1 nm with 2D materials breakthrough

TSMC’s 1-nm chip manufacturing process is starting to take shape. After the findings of its collaboration with MIT and the National University of Taiwan (NTU) were made public this summer, TSMC is reportedly planning a 1-nm fab in Taoyuan, Taiwan. According to a report published in Taiwan News, the new 1-nm chip production facility will … Read more

Two new SHA-3 IP cores optimize performance, resources

Two new IP cores for secure hash algorithm 3 (SHA-3) standard feature more versatile algorithm support. That encompasses support for all four variants of SHA-3 hashing algorithms—224, 256, 384, and 512 bits—as well as for SHAKE and cSHAKE versions and the derivatives KMAC, TupleHash, and ParallelHash. These two SHA-3 IPs unveiled by Xiphera have an … Read more

Intel Foundry Services roadmap unveiled one deal at a time

Intel Foundry Services (IFS) is making its technology roadmap apparent with each new deal it signs, and the message is clear: Intel means business. Through these deals and partnerships, the Santa Clara, California-based chipmaker is cobbling a chip design and manufacturing ecosystem built around EDA tools and IP offerings made available via cloud platforms. Figure … Read more

China’s grey market for chips in the post-export curbs world

China’s grey market for semiconductors—which came into the limelight during the Covid-era chip shortages—could well be under the microscope amid the chip technology export curbs imposed by the United States and its allies. A Bloomberg story takes a sneak peek at how the underground chip market in China threw a lifeline to automakers scrambling for … Read more

Cadence RFIC design flow gains Samsung certification

The Cadence RFIC design flow is now certified on Samsung Foundry’s 8-nm process, accelerating 5G RFIC design for sub-6 GHz and mmWave applications. The 8-nm design flow supports all stages of the RFIC development process, including modeling, electromagnetic-aware RF simulation, and full signoff verification. Using the Samsung-certified design flow, customers can compare circuit simulation results … Read more

eFPGA expands the ecosystem footprint one deal at a time

The design ecosystem around embedded FPGA (eFPGA) technology is gradually expanding, and it’s apparent from the deals QuickLogic has recently made in the design and manufacturing realms. The eFPGA technology provides system-on-chip (SoC) developers with a quick and easy way to embed programmable technology into their chip designs. The eFPGA technology integrated into SoCs enables … Read more

Samsung unveils plans for 2-nm and 1.4-nm process nodes

After kickstarting chip manufacturing at the 3-nm node, Samsung has unveiled plans to launch the 2-nm process in 2025 and 1.4-nm process in 2027, respectively. Like 3-nm process geometry, these new nodes will be based on the gate-all-around (GAA) architecture, which is expected to overcome the performance limitations of FinFET technology by reducing the supply … Read more